Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability (Woodhead Publishing Series in Electronic and Optical Materials)
Key features
- •Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance
- •Provides the latest research on potential solutions, with an eye towards the end goal of system integration
- •Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates
BrandWoodhead Publishing
CategoryHardware & DIY
Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability (Woodhead Publishing Series in Electronic and Optical Materials)
List Price: $234.62$211.16DEALYou Save: $23.46 (10%)
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